Product > Mask Process > Cleaning 
  H2SO4 + H2O2
  Heavy Organic, Metal Á¦°Å
H2SO4 + H2O2 -> H2SO5 + H2O
H2SO5 + Hydro Carbon -> CO2 + H2O + H2SO4
  NH4OH + H2O2 + DIW
  Organic, I/IIÁ· Metal.Particle Á¦°Å
2H2O2 + C -> CO2 + 2H2O
M + H2O2 -> MO + H2O
MO + 4NH4OH -> M(NH4)4+
 
Vaporized IPA


1. Surface Oxidation by H2O2
2. Surface Etching and Particle Lift-off by NH4OH

3. Electrical Repulsion by Surface Charge in Alkaline Solution (-OH)
-The particles are separated and repelled from
  the mask surface simultaneously under the
  SC1 solution.
The interfacial surface tension force that causes particle removal is very powerful and maintains its strength proportionately as particle size decrease

 

Force Relationships
Vander Waal¡¯s ~ r
Interfacial
Surface ~ r
Tension
Spraying ~ r2
Spinning ~ r3
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